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Orthogonal frequency division multiple access OFDMA: Friends who are familiar with Wi-Fi should know that the empty port of Wi-Fi adopts orthogonal frequency division multiplexing (OFDM) modulation, that is, the whole bandwidth is composed of orthogonal subcarriers. In Wi-Fi 6, the 802.11 working group introduced OFDMA access from LTE. The addition of such an “A” word can be said to have brought a qualitative change to the network capacity. As shown in the figure on the left below, Wi-Fi 5-based OFDM can only allocate all the bandwidth in the channel to one user at any one time, even if that user’s data needs do not need to take up all the bandwidth. When other users connect to the network, they need to wait for the next sending opportunity window (TXOP). This is very inefficient in the use of channel resources, especially when there is a significant increase in equipment.
On April 30th, the day after entering GW, the Nippon Keizai Shimbun published an article saying that Toyota and Daihatsu would not only suspend car production during and after the Golden week due to a chronic shortage of semiconductors. Toyota will close all 14 factories in Japan from April 30 to May 8, the article said. Among them, the Takaoka plant in Toyota City, Aichi Prefecture will stop production of some production lines until May 9, and the Fujisong plant with Toyota car body in Kariya City, Aichi Prefecture will stop production until May 16. In addition to the second Shiga plant, which had previously announced an extension of the shutdown, Dafa will also increase the number of plants at the Dafen first factory and the head office from April 30 to May 8, extending the number of days of shutdown. In addition, the Kyoto plant is scheduled to stop production from May 18 to 19.
The basic content of SoC definition is mainly in two aspects: one is its composition, and the other is its formation process. The composition of the system-level chip can be a system-level chip control logic module, a microprocessor/microcontroller CPU core module, a digital signal processor DSP module, an embedded memory module, and an interface module for external communication, and an ADC/DAC module. Analog front-end modules, power supply, and power management modules, for a wireless SoC there are also RF front-end modules, user-defined logic (which can be implemented by FPGA or ASIC), and micro-electromechanical modules, and more importantly, an SoC chip with embedded Basic software (RDOS or COS and other application software) modules or loadable user software, etc. The system-on-chip formation or generation process includes the following three aspects.
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